Hanputek

PCBA

PCB Assembly

Types of assembly: SMT, BGA, DIP, SIP, Mixed Assembly, etc.
Components footprint: 0201,0402, 0603, 0805,…
Components type: BGA, QFN, QFP, PLCC, SOIC, POP, Connectors
Processes: Lead-free Soldering, AOI, Ware Soldering, Reflow Soldering, X-ray testing, Rework, Conformal Coating, Functional Testing, Packaging.

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Production equipment:

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